JPH0132323Y2 - - Google Patents
Info
- Publication number
- JPH0132323Y2 JPH0132323Y2 JP12573983U JP12573983U JPH0132323Y2 JP H0132323 Y2 JPH0132323 Y2 JP H0132323Y2 JP 12573983 U JP12573983 U JP 12573983U JP 12573983 U JP12573983 U JP 12573983U JP H0132323 Y2 JPH0132323 Y2 JP H0132323Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- melting point
- low melting
- electrode plate
- point alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 54
- 238000002844 melting Methods 0.000 claims description 34
- 230000008018 melting Effects 0.000 claims description 34
- 229910045601 alloy Inorganic materials 0.000 claims description 30
- 239000000956 alloy Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 241001237745 Salamis Species 0.000 claims description 2
- 235000015175 salami Nutrition 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 241000269333 Caudata Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12573983U JPS6033405U (ja) | 1983-08-12 | 1983-08-12 | サ−ジ吸収器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12573983U JPS6033405U (ja) | 1983-08-12 | 1983-08-12 | サ−ジ吸収器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6033405U JPS6033405U (ja) | 1985-03-07 |
JPH0132323Y2 true JPH0132323Y2 (en]) | 1989-10-03 |
Family
ID=30286160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12573983U Granted JPS6033405U (ja) | 1983-08-12 | 1983-08-12 | サ−ジ吸収器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6033405U (en]) |
-
1983
- 1983-08-12 JP JP12573983U patent/JPS6033405U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6033405U (ja) | 1985-03-07 |
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